MMFT5P03HD
12
QT
24
1000
V DD = 15 V
I D = 4 A
8
V DS
V GS
16
V GS = 10 V
T J = 25 ° C
100
t d(off)
t f
4
Q1
Q2
8
t r
I D = 4 A
Q3
T J = 25 ° C
t d(on)
0
0
4
8
12
16
20
0
10
1
10
100
Q G , TOTAL GATE CHARGE (nC)
Figure 8. Gate ? To ? Source and Drain ? To ? Source
Voltage versus Total Charge
R G , GATE RESISTANCE (OHMS)
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
DRAIN ? TO ? SOURCE DIODE CHARACTERISTICS
The switching characteristics of a MOSFET body diode
are very important in systems using it as a freewheeling or
commutating diode. Of particular interest are the reverse
recovery characteristics which play a major role in
determining switching losses, radiated noise, EMI and RFI.
System switching losses are largely due to the nature of
the body diode itself. The body diode is a minority carrier
device, therefore it has a finite reverse recovery time, t rr , due
to the storage of minority carrier charge, Q RR , as shown in
the typical reverse recovery wave form of Figure 11. It is this
stored charge that, when cleared from the diode, passes
through a potential and defines an energy loss. Obviously,
repeatedly forcing the diode through reverse recovery
further increases switching losses. Therefore, one would
like a diode with short t rr and low Q RR specifications to
minimize these losses.
The abruptness of diode reverse recovery effects the
amount of radiated noise, voltage spikes, and current
ringing. The mechanisms at work are finite irremovable
circuit parasitic inductances and capacitances acted upon by
4
V GS = 0 V
T J = 25 ° C
3
2
1
high di/dts. The diode’s negative di/dt during t a is directly
controlled by the device clearing the stored charge.
However, the positive di/dt during t b is an uncontrollable
diode characteristic and is usually the culprit that induces
current ringing. Therefore, when comparing diodes, the
ratio of t b /t a serves as a good indicator of recovery
abruptness and thus gives a comparative estimate of
probable noise generated. A ratio of 1 is considered ideal and
values less than 0.5 are considered snappy.
Compared to ON Semiconductor standard cell density
low voltage MOSFETs, high cell density MOSFET diodes
are faster (shorter t rr ), have less stored charge and a softer
reverse recovery characteristic. The softness advantage of
the high cell density diode means they can be forced through
reverse recovery at a higher di/dt than a standard cell
MOSFET diode without increasing the current ringing or the
noise generated. In addition, power dissipation incurred
from switching the diode will be less due to the shorter
recovery time and lower switching losses.
0
0.5
0.6
0.7
0.8
0.9
1
1.1
V SD , SOURCE?TO?DRAIN VOLTAGE (VOLTS)
Figure 10. Diode Forward Voltage versus Current
http://onsemi.com
6
相关PDF资料
MMFT960T1 MOSFET N-CH 60V 300MA SOT223
MMG3002NT1 IC AMP RF GP 3600MHZ 5.2V SOT-89
MMG3006NT1 TRANS GPA 33DBM 16-QFN
MMG3007NT1 IC AMP RF GP 6000MHZ 5V SOT-89
MMG3H21NT1 TRANS HBT 20.5DBM 19.3DB SOT-89
MMH3111NT1 TRANS GAAS HFET SOT-89
MML20211HT1 IC LNA 2GHZ 21P1DB 8DFN
MMS-1A-V2 0 SENSOR MICRO MACHINED SMD
相关代理商/技术参数
MMFT5P03HDT3 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:TMOS P-CHANNEL FIELD FEECT TRANSISTOR
MMFT6N03HD 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:TMOS POWER 6.0 AMPERES 30 VOLTS
MMFT960T1 功能描述:MOSFET 60V 300mA N-Channel RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
MMFT960T1_06 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Power MOSFET 300 mA, 60 Volts N−Channel SOT−223
MMFT960T1G 功能描述:MOSFET 60V 300mA N-Channel RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
MMFTN123 制造商:Diotec Semiconductor 功能描述:
MMFTN138 制造商:Diotec 功能描述:Bulk
MMFTN170 制造商:Diotec Semiconductor 功能描述: